Vivo X Fold foldable smartphone’s images and price have leaked online. The images have been shared on Twitter by two different tipsters. Vivo X Fold is the company’s first foldable offering and it will be launched on April 11. The phone is tipped to come with a 6.5-inch AMOLED primary display and an 8-inch foldable AMOLED panel. It could come with a quad rear camera setup and a 4,600mAh battery. Meanwhile, the price of the smartphone has been leaked on Weibo.
The first set of Vivo X Fold images comes from MySmartPrice who collaborated with tipster Ishan Agarwal to share the images online. As per the report, Vivo X Fold will be launched in Blue and Grey colour options.
Vivo X Fold specifications
As far as the specifications are concerned, MySmartPrice cites Agarwal as saying that the outer screen of the Vivo phone will measure 6.53-inch and will have a 21:9 aspect ratio. He also says that the foldable AMOLED display measures 8.03-inch and has a 4:3.5 aspect ratio. The Vivo X Fold is tipped to pack a Qualcomm Snapdragon 8 Gen 1 SoC, which could be paired with 12GB of RAM along with 256GB of UFS 3.1 storage. The handset is speculated to pack a 4,600mAh battery with support for 66W wired fast charging and 50W wireless charging.
For photography, the Vivo X Fold foldable smartphone is said to pack a circular camera module with a quad-camera system. The camera may get a 50-megapixel main sensor with f/1.75 lens, a 48-megapixel ultra-wide camera, a 12-megapixel portrait camera, and an 8-megapixel periscope camera with 5X optical zoom and up to 60x digital zoom. For selfies and video calls, the phone is tipped to carry a 16-megapixel front shooter. Both screens are tipped to come with an in-display fingerprint scanner.
These specifications are in line with ones shared by tipster Mukul Sharma on Twitter. He has also shared a set of images of the Vivo X Fold.
vivo X Fold
8-inch 2K display 120Hz
6.53-inch FHD+ external 120Hz
Hi-Res Audio certification
TUV Rheinland certification
Snapdragon 8 Gen 1
50MP main OIS, 48MP ultra-wide, 12MP portrait, 5MP 60x periscope OIS
4,600mAh battery, 66W wired, 50W wireless
Android 12#vivoXFold pic.twitter.com/r6kvN6Fp9B
— Mukul Sharma (@stufflistings) April 8, 2022
Vivo X Fold price
Citing Weibo, Sharma has also shared the information about the prices of the variants that Vivo X Fold is speculated to offer. He shared an image which also has full specifications. The Vivo X Fold smartphone is said to start at CNY 11,999 (roughly Rs. 1,43,100) for the base variant, and the top variant could be sold for CNY 12,999 (roughly Rs. 1,55,000).
— Mukul Sharma (@stufflistings) April 8, 2022
Motorola Flagship With Snapdragon 8+ Gen 1 SoC, 200-Megapixel Camera Confirmed to Launch Soon in China Soon
Motorola has confirmed the launch of a new smartphone in China in July. This Motorola smartphone is said to be powered by the Snapdragon 8+ Gen 1 SoC and will have a 200-megapixel camera. It could be a new flagship model by the Lenovo-owned company, which is said to be called the Motorola Edge X30 Pro in China. The phone could be launched in other regions under the Motorola Edge 30 Ultra moniker. Previous rumours indicate that Motorola’s upcoming smartphone could use the 200-megapixel Samsung ISOCELL HP1 sensor.
Motorola has confirmed the launch of a new smartphone in China in July by sharing teasers on Weibo. The images confirm that the upcoming smartphone will be powered by the Qualcomm Snapdragon 8+ Gen 1 SoC and will feature a 200-megapixel camera. As mentioned above, the upcoming smartphone may be launched as the Motorola Edge X30 Pro in China and as the Motorola Edge 30 Ultra in other markets.
Motorola Edge 30 Ultra specifications (rumoured)
The Motorola Edge 30 Ultra smartphone is tipped to sport a 6.67-inch HD+ OLED display with a refresh rate of 144Hz. The Dual-SIM smartphone may run on Android 12 out of the box and is said to come in two RAM and storage configurations — 8GB + 128GB and 12GB + 256GB.
The highlight of this phone will be the 200-megapixel rear camera that is said to use the Samsung ISOCELL HP1 sensor. This sensor will reportedly be used in the upcoming Samsung Galaxy S23 Ultra smartphone as well. The Motorola Edge 30 Ultra’s triple rear camera system is tipped to include two 50-megapixel snappers and a 2-megapixel depth sensor. For selfies, the smartphone is expected to get a 60-megapixel shooter.
Motorola’s upcoming flagship phone is also said to pack a 5,000mAh battery with 68W fast charging support.
Moto E32s India Launch Date Tipped as May 27; Render, Specifications Leak
Moto E32s, a rumoured new handset from Motorola, is reportedly making its way to the Indian market soon. The handset is yet to be officially confirmed by the Lenovo-owned company, but ahead of it, a purported render along with key specifications of the phone have now surfaced online. The leaked render shows a design identical to the Moto E32 that was unveiled in Europe recently. It is seen with a hole-punch display and triple rear cameras. The Moto E32s is tipped to launch on May 27 in the country.
Known tipster Mukul Sharma (@stufflistings) on Twitter suggested the India launch date, render, and specifications of Moto E32s. As per the leak, the smartphone will be launched in India on May 27. The render shows the handset in a Slate Gray shade with a centrally-aligned hole-punch cutout. It is seen sporting a rear camera unit paired with an LED flash. The camera unit is arranged in the upper left corner of the handset and there is a Motorola branding at the back. Further, the power button and the volume rocker are seen on the left spine of the smartphone. As mentioned, the positioning and the design of the rear camera module are notably quite similar to what we have seen on Moto E32.
The upcoming Moto E32s could run on Android 12. It is tipped to feature a 6.5-inch IPS LCD display with 90Hz refresh rate.
However, Motorola hasn’t officially revealed any information regarding the launch date of the smartphone yet.
The Moto E32 was launched in Europe in May first week with a price tag of EUR 149 (roughly Rs. 12,000) for the lone 4GB of RAM and 64GB storage variant. The Moto E32 features a 6.5-inch HD+display with 90Hz refresh rate and is powered by an octa-core Unisoc T606 SoC, along with 4GB of RAM. It carries a triple rear camera setup led by a 16-megapixel primary sensor and packs 64GB of inbuilt storage that is expandable via microSD card (up to 1TB) through a dedicated slot. The phone packs a 5,000mAh battery with 18W charging support.
MediaTek Dimensity 1050 SoC With mmWave 5G Support Launched, Dimensity 930, Helio G99 SoCs Also Debut
MediaTek, the Taiwanese mobile chipmaker, on Monday announced the Dimensity 1050 system-on-chip (SoC) as its latest model in the Dimensity portfolio. The new chip is the company’s first offering to support millimetre-wave (mmWave) 5G connectivity alongside the widely adopted sub-6GHz frequency. The addition of mmWave 5G to the Dimensity 1050 SoC has enabled MediaTek to make the competition tougher for Qualcomm that already has its Snapdragon platforms with support for the same cellular network technology. MediaTek also brought the Dimensity 930 and Helio G99 as two other chips for the next-generation smartphones.
Based on the TSMC 6nm process technology, the MediaTek Dimensity 1050 SoC carries an octa-core CPU. The chip supports 3CC carrier aggregation on sub-6GHz (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum. The company claims that the Dimensity 1050 is capable of delivering up to 53 percent faster speeds and greater reach to smartphones over the LTE + mmWave aggregation.
The presence of mmWave 5G support on the Dimensity 1050 will help provide better connectivity in smaller, densely populated areas.
MediaTek has integrated two ARM Cortex-A78 CPUs with speeds reaching 2.5GHz and the ARM Mali-G610 graphics processing unit with the new Dimensity SoC. There is also support for Wi-Fi optimisations and Wi-Fi 6E support along with 2×2 MIMO antenna as well as MediaTek’s HyperEngine 5.0 gaming technology to support lower-latency connections with the new triband — 2.4GHz, 5GHz, and 6GHz frequency. The chip also includes support for UFS 3.1 storage and LPDDR5 memory.
The Dimensity 1050 SoC supports 144Hz full-HD+ displays, along with MediaTek’s Miravision 760 video enhancement technology. The chip is capable of delivering simultaneous streams through the front and rear cameras of the device using a dual HDR video capture engine. Further, there is MediaTek’s APU 550 to support artificial intelligence (AI) based camera actions. The company also claims that there is an enhanced noise reduction for low-light shots.
In addition to the Dimensity 1050 SoC, MediaTek unveiled the Dimensity 930 as its new 5G chip to support mixed duplex FDD+TDD for fast connectivity. The chip also includes support for 120Hz full-HD+ displays along with MiraVision HDR video playback support and HDR10+ video. Additionally, there are HyperEngine 3.0 Lite gaming enhancements that are touted to enable lower latency and an enhanced battery life.
The company also introduced the MediaTek Helio G99 as an upgrade to the Helio G96. The new 4G chip is claimed to deliver more than 30 percent power savings for gaming over the previous Helio model.
On the availability part, smartphones based on the Dimensity 1050 and Helio G99 will be available in the third quarter, while the Dimensity 930 will debut in the global markets in the second quarter, MediaTek said.
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