Apple Led Smartphone Shipments in Q4 2021, Samsung Close Second Amid Chip Shortage: Canalys
Apple was the most popular smartphone manufacturer in terms of worldwide smartphone shipments for Q4 2021, according to a report by market analyst firm Canalasy. The Cupertino-based smartphone manufacturer took the first spot from competitor Samsung, and accounted for 22 percent of global smartphone sales in the last quarter despite supply chain issues, and rising coronavirus cases around the world. Meanwhile, Chinese smartphone manufacturers Xiaomi, Oppo and Vivo were in third, fourth and fifth places, with 12 percent, 9 percent and 8 percent market share, respectively.
According to a report by Canalys, Apple finally managed to beat Samsung for the top spot in the smartphone shipments competition, thanks to strong demand for the iPhone 13 series. “Apple saw unprecedented iPhone performance in Mainland China, with aggressive pricing for its flagship devices keeping the value proposition strong,” the report states. The company’s supply chain was also affected due to the pandemic leading to production cuts (and increased waiting times in some markets) but appears to be recovering, according to the report.
|Vendor||Q4 2020 Market Share||Q4 2021 Market Share|
According to the report, Samsung was in second place and accounted for 20 percent of worldwide smartphone shipments in Q4 2021. The South Korean smartphone maker has shown an improvement compared to Q4 2020, when it accounted for 17 percent of global smartphone shipments. Meanwhile, Xiaomi was in third place with 12 percent of handsets sold worldwide. Oppo and Vivo took fourth and fifth place with 9 percent and 8 percent respectively, according to the report.
Back in December, Bloomberg reported that Apple had informed suppliers it did not expect customers to maintain interest after long wait times for the company’s latest iPhone 13 series. The report suggested that the Cupertino company expects supplies to improve in 2022. Apple previously cut iPhone 13 production plans by 10 million units, thanks in part to the global chip shortage that has resulted in a shortage of iPhone components, according to an older report by Bloomberg.
The global semiconductor shortage appears to be affecting companies other than Apple, and the Canalys report states that smartphone manufacturers are adapting to the difficulties posed by the component shortage that is not expected to improve until the second half of 2022. Smartphone makers are reportedly modifying their device specifications to adapt to available components. Moves like prioritising best-selling smartphones and spreading out product releases over longer periods will help bigger firms tide over the challenges posed by the semiconductor shortage, according to the report.
Motorola Flagship With Snapdragon 8+ Gen 1 SoC, 200-Megapixel Camera Confirmed to Launch Soon in China Soon
Motorola has confirmed the launch of a new smartphone in China in July. This Motorola smartphone is said to be powered by the Snapdragon 8+ Gen 1 SoC and will have a 200-megapixel camera. It could be a new flagship model by the Lenovo-owned company, which is said to be called the Motorola Edge X30 Pro in China. The phone could be launched in other regions under the Motorola Edge 30 Ultra moniker. Previous rumours indicate that Motorola’s upcoming smartphone could use the 200-megapixel Samsung ISOCELL HP1 sensor.
Motorola has confirmed the launch of a new smartphone in China in July by sharing teasers on Weibo. The images confirm that the upcoming smartphone will be powered by the Qualcomm Snapdragon 8+ Gen 1 SoC and will feature a 200-megapixel camera. As mentioned above, the upcoming smartphone may be launched as the Motorola Edge X30 Pro in China and as the Motorola Edge 30 Ultra in other markets.
Motorola Edge 30 Ultra specifications (rumoured)
The Motorola Edge 30 Ultra smartphone is tipped to sport a 6.67-inch HD+ OLED display with a refresh rate of 144Hz. The Dual-SIM smartphone may run on Android 12 out of the box and is said to come in two RAM and storage configurations — 8GB + 128GB and 12GB + 256GB.
The highlight of this phone will be the 200-megapixel rear camera that is said to use the Samsung ISOCELL HP1 sensor. This sensor will reportedly be used in the upcoming Samsung Galaxy S23 Ultra smartphone as well. The Motorola Edge 30 Ultra’s triple rear camera system is tipped to include two 50-megapixel snappers and a 2-megapixel depth sensor. For selfies, the smartphone is expected to get a 60-megapixel shooter.
Motorola’s upcoming flagship phone is also said to pack a 5,000mAh battery with 68W fast charging support.
Moto E32s India Launch Date Tipped as May 27; Render, Specifications Leak
Moto E32s, a rumoured new handset from Motorola, is reportedly making its way to the Indian market soon. The handset is yet to be officially confirmed by the Lenovo-owned company, but ahead of it, a purported render along with key specifications of the phone have now surfaced online. The leaked render shows a design identical to the Moto E32 that was unveiled in Europe recently. It is seen with a hole-punch display and triple rear cameras. The Moto E32s is tipped to launch on May 27 in the country.
Known tipster Mukul Sharma (@stufflistings) on Twitter suggested the India launch date, render, and specifications of Moto E32s. As per the leak, the smartphone will be launched in India on May 27. The render shows the handset in a Slate Gray shade with a centrally-aligned hole-punch cutout. It is seen sporting a rear camera unit paired with an LED flash. The camera unit is arranged in the upper left corner of the handset and there is a Motorola branding at the back. Further, the power button and the volume rocker are seen on the left spine of the smartphone. As mentioned, the positioning and the design of the rear camera module are notably quite similar to what we have seen on Moto E32.
The upcoming Moto E32s could run on Android 12. It is tipped to feature a 6.5-inch IPS LCD display with 90Hz refresh rate.
However, Motorola hasn’t officially revealed any information regarding the launch date of the smartphone yet.
The Moto E32 was launched in Europe in May first week with a price tag of EUR 149 (roughly Rs. 12,000) for the lone 4GB of RAM and 64GB storage variant. The Moto E32 features a 6.5-inch HD+display with 90Hz refresh rate and is powered by an octa-core Unisoc T606 SoC, along with 4GB of RAM. It carries a triple rear camera setup led by a 16-megapixel primary sensor and packs 64GB of inbuilt storage that is expandable via microSD card (up to 1TB) through a dedicated slot. The phone packs a 5,000mAh battery with 18W charging support.
MediaTek Dimensity 1050 SoC With mmWave 5G Support Launched, Dimensity 930, Helio G99 SoCs Also Debut
MediaTek, the Taiwanese mobile chipmaker, on Monday announced the Dimensity 1050 system-on-chip (SoC) as its latest model in the Dimensity portfolio. The new chip is the company’s first offering to support millimetre-wave (mmWave) 5G connectivity alongside the widely adopted sub-6GHz frequency. The addition of mmWave 5G to the Dimensity 1050 SoC has enabled MediaTek to make the competition tougher for Qualcomm that already has its Snapdragon platforms with support for the same cellular network technology. MediaTek also brought the Dimensity 930 and Helio G99 as two other chips for the next-generation smartphones.
Based on the TSMC 6nm process technology, the MediaTek Dimensity 1050 SoC carries an octa-core CPU. The chip supports 3CC carrier aggregation on sub-6GHz (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum. The company claims that the Dimensity 1050 is capable of delivering up to 53 percent faster speeds and greater reach to smartphones over the LTE + mmWave aggregation.
The presence of mmWave 5G support on the Dimensity 1050 will help provide better connectivity in smaller, densely populated areas.
MediaTek has integrated two ARM Cortex-A78 CPUs with speeds reaching 2.5GHz and the ARM Mali-G610 graphics processing unit with the new Dimensity SoC. There is also support for Wi-Fi optimisations and Wi-Fi 6E support along with 2×2 MIMO antenna as well as MediaTek’s HyperEngine 5.0 gaming technology to support lower-latency connections with the new triband — 2.4GHz, 5GHz, and 6GHz frequency. The chip also includes support for UFS 3.1 storage and LPDDR5 memory.
The Dimensity 1050 SoC supports 144Hz full-HD+ displays, along with MediaTek’s Miravision 760 video enhancement technology. The chip is capable of delivering simultaneous streams through the front and rear cameras of the device using a dual HDR video capture engine. Further, there is MediaTek’s APU 550 to support artificial intelligence (AI) based camera actions. The company also claims that there is an enhanced noise reduction for low-light shots.
In addition to the Dimensity 1050 SoC, MediaTek unveiled the Dimensity 930 as its new 5G chip to support mixed duplex FDD+TDD for fast connectivity. The chip also includes support for 120Hz full-HD+ displays along with MiraVision HDR video playback support and HDR10+ video. Additionally, there are HyperEngine 3.0 Lite gaming enhancements that are touted to enable lower latency and an enhanced battery life.
The company also introduced the MediaTek Helio G99 as an upgrade to the Helio G96. The new 4G chip is claimed to deliver more than 30 percent power savings for gaming over the previous Helio model.
On the availability part, smartphones based on the Dimensity 1050 and Helio G99 will be available in the third quarter, while the Dimensity 930 will debut in the global markets in the second quarter, MediaTek said.
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