In a major crackdown on Chinese mobile companies, the Income Tax department is conducting searches on leading Chinese mobile companies across the country.
More than two dozen premises are covered in the search which started on Tuesday.
“Raids are ongoing in Delhi, Mumbai, Bengaluru, Greater Noida, Kolkata, Guwahati, Indore, and some other places,” sources told ANI.
Sources told ANI that some fintech companies are also covered in this search.
Chief Executive Officers of these companies are covered in this search and currently, they are being interrogated by the Income Tax sleuths.
Further, sources informed that the search was conducted on the intelligence inputs of huge tax evasion by these Chinese mobile firms. They were under the radar for a long time and when the income tax department got concrete intelligence of tax evasion then raids were conducted on these companies.
According to sources, it is early to reveal details about the ongoing search as the sleuths are on job but a substantial amount of digital data evidencing evasion of tax has been found and seized.
Earlier in August, a Chinese government-controlled telecom vendor, ZTE was searched. Searches were conducted at a total of five premises of ZTE, including the corporate office, the residence of the foreign director, the residence of the company secretary, the account person and the cash handler of the company.
During the search on ZTE, the examination of import bills vis-a-vis sale bills shows that there was a gross profit of approximately 30 percent on the trading of the equipment, though the company had been booking “huge” losses over the years.
Investigation revealed that the losses are being booked by the company through bogus expenses in respect of services provided by it. A few such recipients have been identified in whose case substantial expenses have been booked over the years. These entities have been found to be non-existent at their addresses, sources added.
Motorola Flagship With Snapdragon 8+ Gen 1 SoC, 200-Megapixel Camera Confirmed to Launch Soon in China Soon
Motorola has confirmed the launch of a new smartphone in China in July. This Motorola smartphone is said to be powered by the Snapdragon 8+ Gen 1 SoC and will have a 200-megapixel camera. It could be a new flagship model by the Lenovo-owned company, which is said to be called the Motorola Edge X30 Pro in China. The phone could be launched in other regions under the Motorola Edge 30 Ultra moniker. Previous rumours indicate that Motorola’s upcoming smartphone could use the 200-megapixel Samsung ISOCELL HP1 sensor.
Motorola has confirmed the launch of a new smartphone in China in July by sharing teasers on Weibo. The images confirm that the upcoming smartphone will be powered by the Qualcomm Snapdragon 8+ Gen 1 SoC and will feature a 200-megapixel camera. As mentioned above, the upcoming smartphone may be launched as the Motorola Edge X30 Pro in China and as the Motorola Edge 30 Ultra in other markets.
Motorola Edge 30 Ultra specifications (rumoured)
The Motorola Edge 30 Ultra smartphone is tipped to sport a 6.67-inch HD+ OLED display with a refresh rate of 144Hz. The Dual-SIM smartphone may run on Android 12 out of the box and is said to come in two RAM and storage configurations — 8GB + 128GB and 12GB + 256GB.
The highlight of this phone will be the 200-megapixel rear camera that is said to use the Samsung ISOCELL HP1 sensor. This sensor will reportedly be used in the upcoming Samsung Galaxy S23 Ultra smartphone as well. The Motorola Edge 30 Ultra’s triple rear camera system is tipped to include two 50-megapixel snappers and a 2-megapixel depth sensor. For selfies, the smartphone is expected to get a 60-megapixel shooter.
Motorola’s upcoming flagship phone is also said to pack a 5,000mAh battery with 68W fast charging support.
Moto E32s India Launch Date Tipped as May 27; Render, Specifications Leak
Moto E32s, a rumoured new handset from Motorola, is reportedly making its way to the Indian market soon. The handset is yet to be officially confirmed by the Lenovo-owned company, but ahead of it, a purported render along with key specifications of the phone have now surfaced online. The leaked render shows a design identical to the Moto E32 that was unveiled in Europe recently. It is seen with a hole-punch display and triple rear cameras. The Moto E32s is tipped to launch on May 27 in the country.
Known tipster Mukul Sharma (@stufflistings) on Twitter suggested the India launch date, render, and specifications of Moto E32s. As per the leak, the smartphone will be launched in India on May 27. The render shows the handset in a Slate Gray shade with a centrally-aligned hole-punch cutout. It is seen sporting a rear camera unit paired with an LED flash. The camera unit is arranged in the upper left corner of the handset and there is a Motorola branding at the back. Further, the power button and the volume rocker are seen on the left spine of the smartphone. As mentioned, the positioning and the design of the rear camera module are notably quite similar to what we have seen on Moto E32.
The upcoming Moto E32s could run on Android 12. It is tipped to feature a 6.5-inch IPS LCD display with 90Hz refresh rate.
However, Motorola hasn’t officially revealed any information regarding the launch date of the smartphone yet.
The Moto E32 was launched in Europe in May first week with a price tag of EUR 149 (roughly Rs. 12,000) for the lone 4GB of RAM and 64GB storage variant. The Moto E32 features a 6.5-inch HD+display with 90Hz refresh rate and is powered by an octa-core Unisoc T606 SoC, along with 4GB of RAM. It carries a triple rear camera setup led by a 16-megapixel primary sensor and packs 64GB of inbuilt storage that is expandable via microSD card (up to 1TB) through a dedicated slot. The phone packs a 5,000mAh battery with 18W charging support.
MediaTek Dimensity 1050 SoC With mmWave 5G Support Launched, Dimensity 930, Helio G99 SoCs Also Debut
MediaTek, the Taiwanese mobile chipmaker, on Monday announced the Dimensity 1050 system-on-chip (SoC) as its latest model in the Dimensity portfolio. The new chip is the company’s first offering to support millimetre-wave (mmWave) 5G connectivity alongside the widely adopted sub-6GHz frequency. The addition of mmWave 5G to the Dimensity 1050 SoC has enabled MediaTek to make the competition tougher for Qualcomm that already has its Snapdragon platforms with support for the same cellular network technology. MediaTek also brought the Dimensity 930 and Helio G99 as two other chips for the next-generation smartphones.
Based on the TSMC 6nm process technology, the MediaTek Dimensity 1050 SoC carries an octa-core CPU. The chip supports 3CC carrier aggregation on sub-6GHz (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum. The company claims that the Dimensity 1050 is capable of delivering up to 53 percent faster speeds and greater reach to smartphones over the LTE + mmWave aggregation.
The presence of mmWave 5G support on the Dimensity 1050 will help provide better connectivity in smaller, densely populated areas.
MediaTek has integrated two ARM Cortex-A78 CPUs with speeds reaching 2.5GHz and the ARM Mali-G610 graphics processing unit with the new Dimensity SoC. There is also support for Wi-Fi optimisations and Wi-Fi 6E support along with 2×2 MIMO antenna as well as MediaTek’s HyperEngine 5.0 gaming technology to support lower-latency connections with the new triband — 2.4GHz, 5GHz, and 6GHz frequency. The chip also includes support for UFS 3.1 storage and LPDDR5 memory.
The Dimensity 1050 SoC supports 144Hz full-HD+ displays, along with MediaTek’s Miravision 760 video enhancement technology. The chip is capable of delivering simultaneous streams through the front and rear cameras of the device using a dual HDR video capture engine. Further, there is MediaTek’s APU 550 to support artificial intelligence (AI) based camera actions. The company also claims that there is an enhanced noise reduction for low-light shots.
In addition to the Dimensity 1050 SoC, MediaTek unveiled the Dimensity 930 as its new 5G chip to support mixed duplex FDD+TDD for fast connectivity. The chip also includes support for 120Hz full-HD+ displays along with MiraVision HDR video playback support and HDR10+ video. Additionally, there are HyperEngine 3.0 Lite gaming enhancements that are touted to enable lower latency and an enhanced battery life.
The company also introduced the MediaTek Helio G99 as an upgrade to the Helio G96. The new 4G chip is claimed to deliver more than 30 percent power savings for gaming over the previous Helio model.
On the availability part, smartphones based on the Dimensity 1050 and Helio G99 will be available in the third quarter, while the Dimensity 930 will debut in the global markets in the second quarter, MediaTek said.
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